Direct-to-chip engineering for the rack-scale GPU era
Why air stops working. Glycol coolant chemistry and flow paths. The failure modes that matter.
Air cooling stops working as a primary thermal medium somewhere around 50 kilowatts per rack. From that crossover up to the 600 kilowatts that the Vera Rubin Ultra NVL576 will draw, every kilowatt has to be moved by liquid. This paper covers the mechanics of doing that at production scale. We work through the cold plate design, the rack-level coolant distribution, the row-level coolant distribution unit (CDU), the secondary coolant loop, and the heat exchanger that hands the heat off to the building heat-rejection plant, which rejects to air through dry coolers rather than evaporative towers. We use propylene glycol coolant in the primary loop, not water, so the cooling chain consumes effectively no freshwater. We explain why. We cover the failure modes specific to high-density direct-to-chip cooling (leaks, hot spots, pump failures, glycol degradation, biological growth) and the control strategy that keeps the loop within tolerance when the load swings by a factor of three between idle and peak inference. The paper is based on the cooling architecture HyperNext is deploying at Kakinada with our cooling-system partners.
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Request paper · HN-RP-006.pdfHyperNext Research. (29 April 2026). Liquid Cooling at 600 kW per Rack: Direct-to-chip engineering for the rack-scale GPU era. HyperNext Data Center Limited. HN-RP-006. Retrieved from https://www.hypernxt.com/research/hn-rp-006
@techreport{hypernext_hn_rp_006,
title = {Liquid Cooling at 600 kW per Rack: Direct-to-chip engineering for the rack-scale GPU era},
author = {HyperNext Research},
institution = {HyperNext Data Center Limited},
number = {HN-RP-006},
year = {2026},
url = {https://www.hypernxt.com/research/hn-rp-006}
}