In-house engineering / Cooling

Direct-to-chip cooling.
No CDU. No rip-and-replace.

A hybrid direct-to-chip cooling system we built in-house for the generation of GPUs that now pull up to 1400W each. It puts liquid where the heat actually is and lets air handle the rest, rejects that heat through a compact sidecar exchanger instead of an expensive coolant distribution unit, retrofits into servers you already own, runs on any dielectric fluid or DI water, and reports to our own BMS.

HyperNext in-house direct-to-chip cooling prototype: a blue anodised cold-plate and sidecar heat-exchanger block with an inspection window showing the copper microchannel and coolant, and a blue feed line

The sidecar heat-exchanger prototype on the bench. The window shows the microchannel cold plate and the coolant moving through it.

The problem

A single chip now pulls
1400 watts.

A top-end accelerator used to draw a few hundred watts. The newest pull up to 1400. Air alone cannot move that much heat out of a dense rack, and the usual fix, full direct-to-chip with a row-scale coolant distribution unit, is expensive, heavy, and assumes you are building the hall from scratch.

Most operators are not building from scratch. They have racks and servers already in the ground, and a refresh cycle that does not wait for a new cooling plant. So we built for that reality instead.

What we built

Liquid where it counts.
Air where it still works.

A hybrid. Direct-to-chip liquid cooling takes the heat off the hottest parts, the GPUs and CPUs, and air handles everything else. You cool what needs liquid and no more.

The part we are proudest of is the sidecar thermal heat exchanger. It sits beside the rack, not in a separate row of plant, and rejects the loop's heat in a fraction of the footprint and pump energy a conventional CDU needs. It runs on any dielectric fluid, or on DI water, and it asks for very little fluid top-up across a year. The chemistry is watched live on the same BMS that runs our inline fluid-quality valves, so the coolant is changed on condition, not on a calendar.

The number that matters

Up to 37% less
cooling power.

Against conventional cooling, the system uses up to 37% less cooling power. Less pump energy, less fan energy, less fluid, less plant. On a hall sized in megawatts, that is real money and real carbon off the bill every month.

Direct-to-chip cooling installed in a live rack: braided coolant lines routed to the servers, with status lighting on the nodes

The hybrid loop running in a rack. Liquid to the hot parts, air for the rest, all on the HyperNext BMS.

Retrofit, not replace

It goes into the servers
you already own.

It was designed to drop into hardware that already exists. No new hall, no row of CDUs, no forklift upgrade. The same approach fits an older-generation server as easily as a new one, which is the difference between a pilot and something you can actually roll out at scale.

Server nodes prepared for the HyperNext direct-to-chip cooling retrofit, showing the chassis bays and drive sleds

Retrofit into existing nodes. The cooling is fitted to the servers, not the other way round.

The build

What it is, in short.

Approach
Hybrid liquid and air
Direct-to-chip liquid on the GPUs and CPUs, air for the rest. Sized for accelerators up to 1400W TDP.
Heat rejection
Sidecar exchanger, no CDU
A compact heat exchanger beside the rack in place of a row-scale coolant distribution unit. Less footprint, less pump energy, minimal annual fluid top-up.
Fluid
Dielectric or DI water
Runs on any dielectric fluid, or on deionised water, with the loop chemistry monitored live on the BMS.
Fit
Retrofit, old or new
Designed to retrofit into existing servers, including older generations, without rebuilding the hall.
Efficiency
Up to 37% less cooling power
Measured against conventional cooling. Less pump, fan and plant energy across the cooling system.
Status
Prototype, bound for HN1
In-house engineered prototype, on our own BMS, being readied for the HN1 Phase 1 campus in Hyderabad.

Built in-house, running on our own BMS. The point was never a science project. It was a way to cool 1400W chips in racks that already exist, without a coolant plant that costs more than the servers it cools.

Notes from the benchHyperNext Data Center Limited · HN1 Phase 1, Hyderabad
Engineering at HyperNext

More from the bench.

This is one of the systems we engineered in-house rather than bought off a shelf. See the rest, or talk to us about putting them to work in an HN1 deployment.

See what else we build